The Calibre DesignEnhancer software, which Siemens EDA unveiled at the Design Automation Conference (DAC) in July 2023, has been incorporated into a process design kit (PDK) of Samsung Foundry. The ...

For design teams adopting 3D-IC architectures, the relentless pursuit of performance and reliability brings a familiar, yet ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

In the realm of high-performance IC (integrated circuit) design, symmetry is not just an aesthetic preference—it’s a critical factor for ensuring proper device functionality, especially in analog and ...

Xinyx IC Design B.V. is a 100% Filipino owned IC Design house and has been in operations since 2009, with more than a decade of experience in the field of integrated circuit design, giving its clients ...

The strengths of Taiwan's IC design sector include excellent and dedicated STEM talent, a complete semiconductor industry ecosystem from upstream to downstream, and a well-developed downstream ICT ...

Microchip Technology’s MCP3909 energy-measurement IC and the MCP3909 3-Phase Energy Meter Reference Design enable designers to quickly design and develop energy meter designs. The IC combines low ...

For circuit simulation, we have always been enthralled with the Falstad simulator which is a simple, Spice-like simulator that runs in the browser. [Brandon] has a simulator, too, but it simulates ...

Chiplets are like smaller, specialized chips that can be combined to create a bigger, more powerful system. Heterogeneous integration is the fancy term for putting these different chiplets together in ...

In today's designs, application-specific integrated circuits (ASIC) and field-programmable gate arrays (FPGA) must dissipate as little power as possible. Low dissipation ICs comply with government ...