Offered in both silicon and silicon carbide versions, Microchip’s SP1F and SP3F power modules now come with press-fit terminals for high-volume applications. Press-fit terminals enable solder-free PCB ...

Common inverter construction today features large Through-The-Hole (TTH) components along with smaller SMD devices on one side of the PCB, with the power module mounted on the other side and connected ...

JinkoSolar, the global leading PV and ESS supplier, recently released its 2025 annual report and Q1 2026 report. The report shows that its module shipments for the full year of 2025 reached 86.8GW, ...

New power modules have an optimized high-efficiency, compact, and durable design that is ideal for BLDC motor drives The Mega IPM7 series is AOS’ new generation of intelligent power modules engineered ...

Navitas Semiconductor has announced the launch of its new SiCPAK™ power modules, which utilize innovative epoxy-resin potting technology alongside proprietary trench-assisted planar SiC MOSFET ...

Texas Instruments revealed a family of isolated power modules based on its IsoShield multichip packaging technology, claiming 3X higher power density than discrete solutions in isolated power designs.