EDN

SystemC standards group releases transaction-level modeling standard

SystemC standards group Open SystemC Initiative (OSCI) has released the SystemC TLM (transaction-level modeling) standard version 1.0. The TLM standard kit, which can be downloaded under an open ...
EDN

SystemC, transaction level modeling simplifies capture

IP companies have heralded a new age in platform-based design for years – ever since semiconductor integration capacity reached the point where entire systems could theoretically be integrated into a ...
Design-Reuse

Open SystemC Initiative Advances IP Interoperability and Reuse with New Draft Standard for Transaction-Level Modeling

SystemC users urged to provide feedback on TLM-2 Draft 2 by January 31st SAN JOSE, Calif. December 4, 2007 The Open SystemC Initiative (OSCI), an independent non-profit organization dedicated to ...
Electronic Design

OSCI Proposes Extensions To TLM Standard

The Open SystemC Initiative (OSCI) has delivered its Draft SystemC Transaction-Level Modeling (TLM) 2.0 kit, containing proposed extensions to OSCI TLM application programming interface (API) ...
Semiconductor Engineering

Interface Additions To The e Language For Effective Communication With SystemC TLM 2.0 Models

The last several years have seen strong adoption of transaction-level models using SystemC TLM 2.0. Those models are used for software validation and virtual prototyping. For functional verification, ...
Semiconductor Engineering

TLM 2.0: Necessary for Co-Simulation

Transaction-level modeling – an abstracted representation of design IP above the RT level — continues to grow in importance for architectural exploration, performance analysis, building virtual ...
Business Wire

IEEE Approves Revised IEEE 1666™ “SystemC Language” Standard for Electronic System-Level Design, Adding Support for Transaction-level Modeling

PISCATAWAY, N.J.--(BUSINESS WIRE)--IEEE, the world's largest professional association advancing technology for humanity, today announced that the IEEE Standards Association (IEEE-SA) Standards Board ...
Business Wire

Reference Virtual Platform of ARM Model Running Linux Under SystemC/TLM-2.0 Released by Open Virtual Platforms (OVP)

THAME, England--(BUSINESS WIRE)--The Open Virtual Platforms (OVP) initiative (www.OVPworld.org) has announced the release of a reference virtual platform of the ARM Integrator development board using ...
Design-Reuse

OCP-IP Delivers New Advanced SystemC TLM Kit

First and only industry-ready kit leveraging OSCI 2.0 ensures OCP-IP kit is the most advanced and complete offering available Beaverton ORE. — April 21, 2009 — Open Core Protocol International ...
Electronic Design

TLM-2.0 APIs Open SystemC To Mainstream Virtual Platform Adoption

At the 45th Design Automation Conference in June 2008, the Open SystemC Initiative (OSCI) announced the ratification of the TLM-2.0 standard, enabling interoperability for transaction ...
it.tmcnet

Carbon Unveils TLM-2.0 Kit for AMBA Protocol Solution

To allow virtual mode reuse in any SystemC environment, Carbon Design Systems announced that it has launched a TLM-2.0 solution for the AMBA protocol to enable modeling the widely adopted AMBA ...