Oxygen vacancies can be controlled by an electric field in oxides, inducing large changes in the thermal conductivity. "Oxides are materials with thermal resistance highly sensitive to oxygen ...

University of Houston researchers have made a groundbreaking discovery in thermal conductivity, overturning an existing theory that boron arsenide (BAs) couldn’t compete with the heat conduction of a ...

With just one measurement, the Hot Disk TPS technique can quickly and easily estimate the material's thermal diffusivity and thermal conductivity. It also gives the user a volumetric heat capacity ...

Fabless semiconductor firm CGD announced two packages for its ICeGaN family of GaN power ICs that enhance thermal performance. Both are variants of the dual-flat no-leads (DFN) package and will debut ...

Over 200 years ago, the famous mathematician Joseph Fourier described a phenomenon related to how heat is transferred between materials. That phenomenon has now been documented for the first time in ...

The new SOP Advance(E) package from Toshiba brings lower loss and higher efficiency to industrial equipment, data centers, and communication base stations. The compact SOP Advance(E) package typically ...

Austrian researchers analyzed commercial ethylene vinyl acetate–polyolefin–ethylene vinyl acetate (EPE) solar encapsulants and found that products sold under the same label can have significantly ...

The spread of artificial intelligence is forcing an uncomfortable truth on semiconductor manufacturing. Thin films, which are essential for isolating signals and insulating different components and ...

Researchers developed a mathematical model showing how brine movement in sea ice enhances heat transfer, potentially improving climate change predictions for polar regions. A new applied mathematical ...

Master Bond EP54TC is a two-component epoxy engineered for heat sink bonding and thermal management applications where efficient heat transfer is critical. Featuring the highest thermal conductivity ...