Renesas unveiled two 2.4GHz RF transceiver technologies supporting the Bluetooth® Low Energy low-power near-field communication standard at ISSCC 2022 ...

There’s a long-running fight between wireless standards to be the one and only to connect all the smart devices in your home. And with an upgrade today, Bluetooth is making a good case for itself.

A new single-chip Bluetooth LSI, designated the TC35654, integrates both RF and baseband circuits The chip employs a 0.18 µm CMOS process technology for the RF circuit instead ...

Bluetooth 5 is here, but few accessories will support it before 2018 They might be worth waiting for by Micah Singleton May 26, 2017, 1:28 PM PDT ...

The integrated impedance-matching circuit technology presented by Renesas at ISSCC 2015 enabled compact and low-cost Bluetooth LE products that required no external inductors or capacitors for ...

SAN JOSE, Calif., December 09, 2002 -- Toshiba America Electronic Components, Inc. (TAEC) today announced a new single-chip Bluetoothâ„¢ large scale integration (LSI) that integrates radio frequency ...

Bluetooth Low Energy IP Cores The integrated impedance-matching circuit technology presented by Renesas at ISSCC 2015 enabled compact and low-cost Bluetooth LE products that required no external ...