Researchers from RIKEN created a self-healing polymer that can repair itself after being damaged by modifying polyolefins, a ...

An Integrated Agentic AI Safety System for Edge Artificial Intelligence” was published by researchers at Princeton University ...

A new technical paper titled “Mitigation of Structural Defects during the Growth of 2D van der Waals Chalcogenides by ...

Multi-modal sensors generate data that edge AI can turn into actionable insights, provided new devices can be integrated with ...

As data center infrastructures adapt to evolving workloads, parts of Ethernet can be found in scale-up approaches.

The hybrid model is emerging as the framework for trustworthy AI in test analytics. It retains traceability and supports ...

PCIe 7.0 pushes signaling rates to an unprecedented 128 GT/s, doubling the bandwidth of PCIe 6.0. While this leap is ...

The shift toward chiplets and multi-die assemblies is forcing big changes in the global supply chain, including much tighter ...

Balancing the benefits provided by community and transparency with the risks posed by capacity and warranty issues.

Modern semiconductor chip design faces growing complexity due to numerous timing scenarios driven by varying operating ...

The rapid advancement of artificial intelligence (AI) is driving unprecedented demand for high-performance memory solutions.

How HBM works, how it compares to previous generations, and why it’s becoming the cornerstone of next-generation computing.