STMicroelectronics joins FiRa board, strengthening commitment to UWB ecosystem and automotive Digital Key adoption Geneva, ...

STMicroelectronics (STM) will invest $60M in its plant in Tours, France amid a push to boost advanced semiconductor manufacturing, known as panel-level packaging. Read for more.

ST Engineering Antycip (Antycip) has integrated its proprietary, certifiable, low-latency image generator MyIG with MAK ...

STMicroelectronics (STM) has announced a US$60 million investment to establish a panel-level packaging (PLP) technology pilot ...

PR N°C3358CSTMicroelectronics to advance next-generation chip manufacturing technology with new PLP pilot line in Tours, ...