JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.
Abstract: The read current margin and memory window (MW) of HfO 2-based ferroelectric FET (FeFET) are comprehensively re-evaluated by considering the impacts of the ferroelectric dynamics and ...
Abstract: We report the advantages of using CMOS directly bonded to array (CBA) technology in 3D flash memory. Improvements in interface speed, operation latency, and memory cell reliability are ...
Asynchronous Task and Memory Interface, or ATMI, is a runtime framework for efficient task management in heterogeneous CPU-GPU systems. It provides a consistent API to create and launch tasks from ...
Memory chips are a key component of artificial intelligence data centers. The boom in AI data center construction has caused a shortage of semiconductors, which are also crucial for electronics like ...
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