Below is a possible Microstation 3D modeling case study for a Pack battery workshop: A new energy company plans to build a new Pack battery workshop and requires 3D modeling to optimize the workshop ...

Tasked with honoring the school’s 150th anniversary, Brigham Young University engineers combined the school’s values of ...

The Beelink GTR9 Pro is powered by the AMD Ryzen AI Max Plus 395 APU, featuring 16 cores, 32 threads, and a 5.1 GHz boost clock, paired with the Radeon 860S iGPU for graphics performance comparable to ...

The latest Qualcomm computing chips are set to pack a powerful punch when they land on the next generation of PCs.

The Fenghua No. 3 is based on the open-source RISC-V architecture, with inputs from the OpenCore Institute's Nanhu V3 project. The new design is expected to ...

I printed one out, and it fit my Joy-Con perfectly, allowing me to use mouse controls without cramping my hand.

CoNi-HESA superalloy shows exceptional performance in 3D printing, combining strength and ductility for high-temperature applications with minimized defects.

With blockchain tokenized ticketing scheduled to launch in Q4, Nextech3D.ai is positioned to participate in both primary ...

Microsoft tests microfluidic cooling that removes heat three times better than cold plates, reducing GPU spikes and lowering ...

High performance liquid chromatography (HPLC) is a widely used and well-established technique, routinely employed by thousands of analytical scientists worldwide. Nonetheless, certain ...

Qualcomm launches the Snapdragon X2 Elite and and X2 Elite Extreme, adding more cores and a whopping 80 TOPS in a bid to win ...

Only the iPhone 17 Pro Max can be configured with 2 TB. That’s not a vanity number if you’re capturing ProRes/RAW regularly, ...