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Last Nov, I had the privilege to emcee the launch of the EPIC Advanced Packaging Platform by Applied Materials, graced by Deputy Prime Minister and Minister for Trade and Industry, Mr. Gan Kim Yong. As shared by Applied Materials, this is “a new collaborative platform for customers and partners to accelerate innovation and commercialization of cutting-edge solutions for the #Al era! Designed to be a catalyst for collaboration, the EPIC Advanced Packaging platform brings together all the essentia
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Inside the Advanced Packaging Matrix Advanced semiconductor packaging is rapidly becoming the critical lever for high-performance AI chips, chiplets, and next-generation electronics. Technologies like InFO, FOWLP, EMIB, and Foveros are reshaping manufacturing, improving power efficiency, and enabling scalable, high-bandwidth solutions for HPC, mobile, and RF applications. At the same time, the industry faces growing demand for technical talent and leadership, highlighting the importance of strat
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